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What is the effect on excessive inter metallic growth caused by wetting time above liquidus (TAL) in reflow soldering process?

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Electrostatic discharge (ESD) protection devices and countermeasure components allow ESD to enter devices and escape to the ground. They are essential for protecting electronic components and ensuring workplace safety.


What is the effect on excessive inter metallic growth caused by wetting time above liquidus (TAL) in reflow soldering process?






 
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